In recent years, as small pitches have been widely recognized in the industry, the market demand for their applications has increased, but some technical bottlenecks have severely restricted its development process, such as traditional LED small-pitch protection performance is low, pixel failure rate is high, Problems such as congenital defects displayed by point light sources have not been solved. Once bumps or vibrations occur, it is easy to cause the lamp beads to fall off and fail, which will cause the product to not be used normally and the service life is greatly reduced...

In order to solve these current problems, protective technologies such as GOB and AOB have emerged. However, in the early stage, because some enterprises were eager for quick success and instant benefits, the technology was not fully mature, so it did not attract enough attention. It is worth mentioning that with the application of new GOB materials, such as the adoption of new high-factor optical thermal conductive nano-filling materials, GOB technology has matured, and it has great potential in the small-pitch market.

GOB is the abbreviation of Glue on board. It is a technology to solve the problem of LED lamp protection. It uses an advanced new transparent material to package the substrate and its LED packaging unit to form effective protection. The material not only has super high transparency, but also has super thermal conductivity. The small pitch of GOB can adapt to harsh environments, and realize the characteristics of real moisture-proof, waterproof, dust-proof, anti-collision, anti-UV and so on.

It is understood that since the launch of new products in 2017 by GOB companies, the technology has matured, and the development of GOB technology has been quite rapid in just two to three years. It can adapt to various application environments and can be applied to small-pitch products or even Mini products, so it has a broad market. Compared with the current large-scale COB, GOB features can solve the problems of COB's inability to mix lights, serious modularization, color difference, poor surface flatness and so on. Especially in the field of traditional small pitch, GOB modules are comparable to COB technology, and are expected to show their talents in commercial display and other fields.

The Difference between GOB and traditional glue module

Through the GOB process, the original granular pixels on the surface of the lamp panel have been transformed into an overall flat lamp panel, realizing the transition from point light source to surface light source, the product light is more uniform, the display effect is more clear and transparent, and greatly improved The viewing angle of the product (both horizontal and vertical can reach nearly 180 degrees), effectively eliminates moiré, significantly improves product contrast, reduces glare and glare, reduces visual fatigue, and effectively protects the safety and health of users .

GOB not only retains the mature technology of SMD and COB, but also solves the bottleneck and pain points of the original products. It is easy to mass produce, stable in quality, and reasonable in price. It meets the needs of the market and can be quickly applied to all areas of the market. Before 2019, the GOB market has not really been developed, only a few display companies are doing it, but as the technology continues to mature, and some foresighted companies are promoting GOB small pitch products, more and more of them are now People are optimistic.

With the small-pitch LEDs in the commercial display market, human-screen interaction has become a basic requirement. To meet the needs of touch and other traditional small-pitch LED displays, improvements must be made in the surface treatment of the screen. GOB technology will be indispensable in the future for small-pitch products entering the commercial display market due to its high flatness and other advantages.